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MX10FMAXDPC MX10FMAXDQC
SINGLE-CHIP 8-BIT MICROCONTROLLER
FEATURE
* * * * * * * * High performance CMOS MTP ROM CPU Operation Voltage 5V Up to 40MHz operation (3.5MHz to 40MHz) Three 16-bit timer/counters 256 Bytes of on-chip data RAM 64 Kbytes on-chip Flash memory 32 Programmable I/O lines 6 interrupt Sources * * * * * * * Code protection Two priority levels Power saving Idle and power down modes 64 K external program memory space 64 K external data memory space Four 8-bit I/O ports Full-duplex enhanced UART compatible with the standard 80C51 and the 80C52
GENERAL DESCRIPTION
The single-chip 8-bit microcontroller is manufactured in MXIC's advanced CMOS process. This device uses the same powerful instruction set, has the same architecture, and is pin-to-pin compatible with the existing 80C51. The added features make it an even more powerful microcontroller for applications that require clock output, and up/down counting capabilities such as motor control. It also has a more versatile serial channel that facilitates multi-processor communications.
PIN CONFIGURATIONS
40 PDIP 44 PLCC
(T2) P1.0 (T2EX) P1.1 P1.2 P1.3 P1.4 P1.5 P1.6 P1.7 RESET (RXD) P3.0 (TXD)P3.1 (INT0) P3.2 (INT1) P3.3 (T0) P3.4 (T1) P3.5 (WR) P3.6 (RD) P3.7 XTAL2 XTAL1 VSS
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20
40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21
XTAL2
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XTAL1
VCC P0.0 (AD0) P0.1 (AD1) P0.2 (AD2) P0.3 (AD3) P0.4 (AD4) P0.5 (AD5) P0.6 (AD6) P0.7 (AD7) EA ALE PSEN P2.7 (A15) P2.6 (A14) P2.5 (A13) P2.4 (A12) P2.3 (A11) P2.2 (A10) P2.1 (A9) P2.0 (A8)
VCC
P1.4
P1.3
P1.2
P1.1
P1.0
P0.0
P0.1
P0.2
P1.5 P1.6 P1.7 RST P3.0 N.C. P3.1 P3.2 P3.3 P3.4 P3.5
7
6
1
44
P0.3 40 39 P0.4 P0.5 P0.6 P0.7 EA 34 N.C. ALE PSEN P2.7 P2.6 29 28 P2.5 P2.4
MX10FMAX
12
MX10FMAX
17 18 P3.6 P3.7 VSS
23 P2.0 P2.1 P2.2 P2.3 N.C.
N.C.
MX10FMAXDPC MX10FMAXDQC
BLOCK DIAGRAM
P0.0-P0.7 P2.0-P2.7
Vcc Vss PORT 0 DRIVERS PORT 2 DRIVERS
RAM ADDR. REGISTER
RAM
PORT 0 LATCH
PORT 2 LATCH
ROM
ACC
STACK POINTER TMP1
PROGRAM ADDR. REGISTER
TMP2 B REGISTER ALU
BUFFER
PC INCREMENTER T0/T1/T2 SFRs TIMERS
PSW
PROGRAM COUNTER
PSEN ALE EA RST TIMING AND CONTROL
INSTRUCTION REGISTER
DPTR
PORT 1 LATCH
PORT 3 LATCH
OSC.
PORT 1 DRIVERS
PORT 3 DRIVERS
XTAL1
XTAL2
P1.0-P1.7
P3.0-P3.7
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Port 2 emits the high-order address byte during fetches from external Program Memory and during accesses to external Data Memory that use 16-bit addresses (MOVX @DPTR). In this application it uses strong internal pullups when emitting 1's. During accesses to external Data Memory that use 8-bit addresses (MOVX @Ri), Port 2 emits the contents of the P2 Special Function Register. Port 3 : Port 3 is an 8-bit bidirectional I/O port with internal pullups. The port 3 output buffers can drive LS TTL inputs. Port 3 pins that have 1's written to them are pulled high by the internal pullups, and in that state can be used as inputs. As inputs, Port 3 pins that are externally pulled low will source current (IIL, on the data sheet) because of the internal pullups. Port 3 also serves the function of various special features of the 8051 Family, as listed below : Port Pin P3.0 P3.1 P3.2 P3.3 P3.4 P3.5 P3.6 P3.7 Alternate Function RXD (serial input port) TXD (serial output port) INT0 (external interrupt 0) INT1 (external interrupt 1) T0 (Timer 0 external input) T1 (Timer 1 external input) WR (external data memory write sttobe) RD (external data memory read strobe)
PROCESS INFORMATION
This device is manufactured on a MXIC CMOS process.
PIN DESCRIPTIONS
VCC : Supply voltage. VSS : Circuit ground. Port 0 : Port 0 is an 8-bit, open drain, bidirectional I/O port. As an output port each pin can sink several LS TTL inputs. Port 0 pins that have 1's written to them float, and in that state can be used as high-impedance inputs. Port 0 is also the multiplexed low-order address and data bus during accesses to external Program and Data Memory. In this application it uses strong internal pullups when emitting 1's, and can source and sink serveral LS TTL inputs. Port 1 : Port 1 is an 8-bit bidirectional I/O port with internal pullups. The port 1 output buffers can drive LS TTL inputs. Port 1 pins that have 1's written to them are pulled high by the internal pullups, and in that state can be used as inputs. As inputs, Port 1 pins that are externally pulled low will source current (IIL, on the data sheet) because of the internal pullups. In additional, Port 1 serves the functions of the following special features of the MX10C805X : Port Pin P1.0 P1.1 Alternate Function T2 (External Count Input to Timer/ Counter 2), Clock-Out T2EX (Timer/Counter 2 Capture/Reload Trigger and Direction Control)
RST : Reset input. A high on this pin for two machine cycles while the oscillator is running resets the device. The port pins will be driven to their reset condition when a minimum VIHI voltage is applied whether the oscillator is running or not. An internal pulldown resistor permits a power-on reset with only a capacitor connected to VCC. ALE : Address Latch Enable output pulse for latching the low byte of the address during accesses to external memory. In normal operation ALE is emitted at a constant rate of 1/6 the oscillator frequency, and may be used for external timing or clocking purposes. Note, however, that one ALE pulse is skipped during each access to external Data Memory.
Port 2 : Port 2 is an 8-bit bidirectional I/O port with internal pullups. The port 2 output buffers can drive LS TTL inputs. Port 2 pins that have 1's written to them are pulled high by the internal pullups, and in that state can be used as inputs. As inputs, Port 2 pins that are externally pulled low will source current (IIL, on the data sheet) because of the internal pullups.
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If desired, ALE operation can be disabled by setting bit 5 of SFR location 87H (PCON). With this bit set, the pin is weakly pulled high. However, the ALE disable feature will be suspended during a MOVX or MOVC instruction, idle mode, power down mode. The ALE disable feature will be terminated by reset. When the ALE disable feature is suspended or terminated, the ALE pin will no longer be pulled up weakly. Setting the ALE-disable bit has no affect if the micrcontroller is in external execution mode. Throughout the remainder of this data sheet, ALE will refer to the signal coming out of the ALE pin, and the pin will be referred to as the ALE pin. PSEN : Program Store Enable is the read strobe to external Program Memory. When the MX10FMAX is executing code from external Program memory, PSEN is activated twice each machine cycle, except that two PSEN activations are skipped during each access to external Data memory. EA/VPP : Extrernal Access enable. EA must be strapped to VSS in order to enable the twiceto fetch code from external Program Memory locations 0000H to 0FFFFH. EA will be internally latched on reset. EA should be strapped to VCC for internal program executions. XTAL1 : Input to the inverting oscillator amplifier. XTAL2 : Output from the inverting oscillator amplifier. OSCILLATOR CHARACTERISTICS XTAL1 and XTAL2 are the input and output, respectively, of a inverting amplifier which can be configured for use as an on-chip oscillator, as shown in Figure 3. Either a quartz crystal or ceramic resonator may be used.
C2 XTAL2 C1 XTAL1 VSS
To drive the device from an external clock source, XTAL1 should be driven, while XTAL2 floats, as shown in Figure 4. There are no requirememts on the duty cycle of the external clock signal, since the input to the internal clocking circuitry is through a divide-by-two flip-flop, but minimum and maximum high and low times specified on the data sheet must be observed. An external oscillator may encounter as much as a 100 pF load at XTAL1 when it starts up. This is due to interaction between the amplifer and its feedback capacitance. Once the external signal meets the VIL and VIH specifications the capacitance will not exceed 20 pF.
N/C
XTAL2
EXTERNAL OSCILLATOR SIGNAL
XTAL1 VSS
Figure 4. External Clock Drive Configuration
C1, C2 = 30 pF is equal to or less than 10 pF for Crystal For Ceramic Resonators,contact resonator manufacture. Figure 3. Oscillator Connections
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IDLE MODE The user's software can invoke the Idle Mode. When the microcontroller is in this mode, power consumption is reduced. The Special Function Registers and the onboard RAM retain their values during Idle, but the processor stops executing instructions. Idle Mode will be exited if the chip is reset or if an enabled interrupt occurs.
ABSOLUTE MAXIMUM RATING*
Ambient Temperature Under Bias Storage Temperature Voltage on Any Other Pin to VSS IOL Per I/O Pin Power Dissipation 0C to 70C -65C to +150C -0.5V to +6.5V 15mA 1.5W
(Based on PACKAGE heat transfer limitations, not device consumption) Table 2. Status of the External Pins during Idle and Power Down Mode Idle Idle Power Down Power Down Program Memory Internal External Internal External ALE 1 1 0 0 PSEN 1 1 0 0 PORT0 Data Float Data Float PORT1 Data Data Data Data PORT2 Data Address Data Data PORT3 Data Data Data Data
POWER DOWN MODE
To save even more power, a Power Down mode can be invoked by software. If this mode, the oscillator is stopped and the instruction that invoked Power Down is the last instruction executed. The on-chip RAM and Special Function Registers retain their values until the Power Down mode is terminated. On the MX10C805X either a hardware reset or an external interrupt can cause an exit from Power Down. Reset redefines all the SFRs but does not change the on-chip RAM. An external interrupt allows both the SFRs and on-chip RAM to retain their values. To properly terminate Power Down, the reset or external interrupt should not be executed before VCC is restored to its normal operating level, and must be held active long enough for the oscillator to restart and stabilize (normally less than 10 ms). With an external interrupt, INT0 and INT1 must be enabled and configured as level-sensitive. Holding the pin low restarts the oscillator but bringing the pin back high completes the exit. Once the interrupt is serviced, the next instruction to be executed after RETI will be the one following the instruction that put the device into Power Down.
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5. PROGRAMMING SPECIFICATION
MX10FMAX has two programming modes, which depends on the P2.6 pin. If P2.6 = 1, then it is in parallel programming mode, if not, then it is in serial programming mode. 5.1 Parallel Programming Mode
4.5/5/6.25V VDD 1 0 12.5~13V,5/6.25/4.5V CE OE 1 WE A[15:0] MS[2:0] RST PSEN EA P3.3 P2.7 P2.6 ALE P3[5:4],P2[5:0],P[7:0] P3.7,P3.1, P3.0 VSS P0[7:0] Q[7:0] XTAL2 XTAL1 4~6MHz
PIN NAME P1.0 ~ P1.7 P2.0 ~ P2.5, P3.4 ~ P3.5 P0.0 ~ P0.7 P3.3 P2.7 ALE EA P3.7, P3.1, P3.0 VDD GND Notice for speed progamming
SYMBOL A0 ~A7 A8 ~ A13, A14 ~A15 Q0 ~ Q7 CE OE WE Vpp MS2 ~ MS0 VDD GND
FUNCTION Input low order address bits Input high order address bits Data Input/Output Chip Enable Input Output Enable Input Write Enable Input Program Supply Voltage, 12.5 ~13Volts Flash Mode Selection Power Supply Voltage (+5V) Ground Pin
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MX10FMAXDPC MX10FMAXDQC
5.1.1 Table of parallel programming modes External Pin Standby Read Signature Program Program Verify Pgm Lock bit #1 Pgm Lock bit #2 Pgm Lock bit #3 Pgm verify Lock bits Erase verify LOCK bits Chip Erase Erase Verify Normal Read EA VDD P3.3 P2.7 ALE P3[5:4], P2[5:0], P1[7:0] X P1.0=0 P1.0=1 address address X X X X X X address address P3.7, P3.1, P3.0 X 000 011 010 111 110 100 101 101 010 011 100 P0[7:0]
X 5V 12.5~13V 12.5~13V 12.5~13V 12.5~13V 12.5~13V 6.25V 4.5V 12.5~13V 12.5~13V X
5V 5V 6.25V 6.25V 6.25V 6.25V 6.25V 6.25V 4.5V 6.25V 4.5V 5V
1 0 0 0 0 0 0 0 0 0 0 0
X 0 1 0 1 1 1 0 0 1 0 0
X 1 100us pulses 1 100us pulses 100us pulses 100us pulses 1 1 0.5sec pulse 1 1
Z MftID=C2H DID=F0H DATA DATA X X X P0[3:1]= LOCK[3:1] P0[3:1]= LOCK[3:1] X DATA DATA
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MX10FMAXDPC MX10FMAXDQC
5.1.2 Timing Waveform in Parallel Programming Mode
READ SIGNATURE AND NORMAL READ WAVEFORM
EA
VDD
ALE
ADDRESS
tAA
A0=0 / A0=1
tAA
P3.3
tCE tCE
P2.7
tOE tOE
VDD P3.7 P3.1,P3.0 GND
tDF tDF
000
XXX
100
P0.7-P0.0
Mft ID/Device ID
OUT
Read Signature
tDF
Normal Read
tAA Mim. Max. unit 120 ns
tCE 120 ns
tOE 70 ns
tDF 0 20 ns
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MX10FMAXDPC MX10FMAXDQC
ERASE AND VERIFY FLOWCHART
START
X=0
Program array all zero (0~64KB) & LOCK
* if LOCK2 is set to 1, we can apply 3 program pulses to each byte and LOCK bits without verifying them
VCC=6.25V VPP=12.5V
Chip erase (0.5 s)
VCC=4.5V VPP=4.5V
Erase-verify LOCK
fail
no
YES
VCC=4.5V VPP=12.5V YES
erase-verify array (0~64KB) pass
fail x=x+1 x=30
yes
Pass device
Pass device
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MX10FMAXDPC MX10FMAXDQC
ERASE AND ERASE VERIFY WAVEFORM
ADDRESS
DON'T CARE
ADDRESS
P0.7-P0.0
VPP=12.5~13V if Erase verify array; VPP=4.5V if Erase verify LOCK bits
DATA
VPP EA VDD P2.7
tVPS
tEV
P3.3
tCES tEW tER
ALE
P3.7, P3.1,P3.0
tMS
010
tMS
011/101
Erase
Erase Verify Array or LOCK bits
Mim. Max. unit
tDS 2 us
tDH 2 us
tVPS 2 us
tMS 2 us
tCES 2 us
tER 0.5 s
tEW 0.45 0.55 s
tEV 240 ns
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MX10FMAXDPC MX10FMAXDQC
PROGRAM AND PROGRAM VERIFY FLOWCHART
START
First Address
VCC=6.25V VPP=12.5V
X=0
YES
Program (20~100us) YES No
Program Verify YES
Fail x=x+1
X=20
Increment Address
No
Last Address
YES VCC=5V VPP=5V Yes Normal Read All Fail
Fail Device
Pass
Pass Device
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PROGRAM AND PROGRAM VERIFY FLOWCHART
ADDRESS
tAS
P0.7~P0.0
tDS
IN
tDH
OUT
EA VDD
VPP
tVPS
P2.7
tPV
P3.3
tCES tPR
tPW
ALE
P3.7, P3.1,P3.0
tMS
011
tMS
010
Program
Program Verify
tAS Mim. Max. unit 2 us
tDS 2 us
tDH 2 us
tVPS 2 us
tCES 2 us
tMS 2 us
tPR 2 us
tPW 20 105 us
tPV 240 ns
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MX10FMAXDPC MX10FMAXDQC
PROGRAM LOCK BITS AND PROGRAM VERIFY LOCK BITS FLOWCHART
START
X=0
VCC=6.25V VPP=12.5V
Program (100us) YES VCC=6.25V VPP=6.25V No
Program Verify YES Apply 10 program pulses to the specified LOCK bit
Fail x=x+1
X=20
Yes
Fail Device
Pass Device
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PROGRAM LOCK BITS AND PROGRAM VERIFY LOCK BITS WAVEFORM
ADDRESS
DON'T CARE
P0.7~P0.0
P0.3~P0.1= lock[3:1]
EA VDD
VPP
tVPS
6.25V
P2.7
tPV
P3.3
tCES tPR
tPW
ALE
P3.7, P3.1,P3.0
tMS
111/110/100
tMS
101
Program Lock Bit(#1/#2/#3)
Lock bit Verify
Mim. Max. unit
tVPS 2 us
tCES 2 us
tMS 2 us
tPR 2 us
tPW 20 105 us
tPV 240 ns
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MX10FMAXDPC MX10FMAXDQC
OPERATING CONDITIONS
Symbol TA VCC fOSC Description Ambient Temperature Under Bias Commerical Oscillator Frequency Min 0 4.5 3.5 Max +70 5.5 40 Units C V MHz
DC CHARACTERISTICS (Over Operating Conditions)
All parameter values apply to all devices unless otherwise indicated.
Symbol VIL VIL1 VIH VIH1 VOL VOL1 VOH Parameter Input Low Voltage Input Low Voltage EA Input High Voltage (Except XTAL1, RST) Input High Voltage (XTAL1, RST) Output Low Voltage (Note 5) (Ports 1, 2, and 3) Output Low Voltage (Note 5) (Port 0, ALE, PSEN) Output High Voltage (Port 1, 2 and 3, ALE, PSEN) VOH1 Output High Voltage (Port 0 in External Bus Mode) IIL ILI ITL Logical 0 Input Current (Ports 1, 2 and 3) Input leakage Current (Port 0) Logical 1 to 0 Transition Current (Ports 1, 2 and 3) Industrial PRST CIO ICC RST Pulldown Resistor Pin Capacitance Power Supply Current: Active Mode at 40 MHz Idle Mode at 40 MHz(70C 5.5V) Power Down Mode 60 40 100 mA mA uA 15 10 150 K ohm pF @1 MHz, 25C (Note 3) 10 -750 uA uA VIN=VIL or VIH VIN=2V 0.9 VDD 0.75 VDD 0.5 VDD 0.9 VDD 0.75 VDD 0.5 VDD -50 0.4 V V V V V V V uA IOL=3.2 mA (Note 1) IOH=-10 uA IOH=-30 uA IOH=-60uA IOH=-80 uA IOH=-300 uA IOH=-800 uA VIN=0.4V 0.4 V IOL=1.6 mA (Note 1) 0.7 VCC VCC+0.5 V Min -0.5 0 0.2 VCC+0.9 Typ Max (Note 4) 0.2 VCC-0.1 0.2 VCC-0.3 VCC+0.5 V V V Unit Test Conditions
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NOTES: 1. Capacitive loading on Ports 0 and 2 may cause noise pulses above 0.4V to be superimposed on the VOLs of ALE and Ports 1, 2 and 3. The noise is due to external bus capacitance discharging into the Port 0 and Port 2 pins when these pins change from 1 to 0. In applications where capacitive loading exceeds 100 pF, the noise pulses on these signlas may exceed 0.8V. It may be desirable to qualify ALE or other signals with a Schmitt Triggers, or CMOS-level input logic. 2. Capacitive loading on Ports 0 and 2 cause the VOH on ALE and PSEN to drop below the 0.9 VCC specification when the address lines are stabilizing. 3. Minimum VCC for Power Down is 2V. 4. Typicals are based on a limited number of samples and are not guaranteed. The values listed are room temperature and 5V. 5. Under steady state (non-transient) conditions, IOL must be externally limited as follows: Maximum IOL per port pin: 10mA Maximum IOL per 8-bit port: Port 0: 26mA Ports 1, 2 and 3: 15mA Maximum total IOL for all output pins: 71mA If IOL exceeds the test condition, VOL may exceed the related specification. Pins are not guaranteed to sink current greater than the listed test conditions.
VCC VCC P0 VCC EA RST MX10FMAX ICC VCC
VCC VCC P0 EA RST MX10FMAX ICC VCC
(NC) CLOCK SIGNAL
XTAL2 XTAL1 VSS
(NC) CLOCK SIGNAL
XTAL2 XTAL1 VSS
All other pins disconnected TCLCH = TCHCL = 5ns
All other pins disconnected TCLCH = TCHCL = 5ns
Figure 6. ICC Test Condition, Active Mode
Figure 7. ICC Test Condition Idle Mode
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VCC VCC P0 EA RST MX10FMAX ICC VCC
(NC)
XTAL2 XTAL1 VSS
All other pins disconnected Figure 8. ICC Test Condition, Power Down Mode VCC=2.0V to 6.0V
VCC-0.5 0.45V 0.7 VCC 0.2 VCC-0.1 TCHCL TCLCX TCLCL Figure 9. Clock Signal Waveform for ICC Tests in Active and Idle Modes. TCLCH = TCHCL = 5 ns TCHCX TCLCH
EXPLANATION OF THE AC SYMBOLS
Each timing symbol has 5 characters. The first character is always a "T" (stands for time). The other characters, depending on their positions, stand for the name of a signal or the logical status of that signal. The following is a list of all the characters and what they stand for. A: Address C: Clock D: Input Data H: Logic level HIGH L: Logic level LOW, or ALE P: PSEN Q: Output Data R: RD signal T: Time V: Valid W: WR signal X: No longer a valid logic level Z: Float For example, TAVLL = Time from Address Valid to ALE Low TLLPL = Time from ALE Low to PSEN Low
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AC CHARACTERISTICS
(Over Operating Conditions, Load Capacitance for Port 0, ALE/PROG and PSEN = 100 pF, Load Capacitance for All Other Outputs = 80 pF) tCK min. = 1/f max. (maximum operating frequency); tCK=clock period SYMBOL PARAMETER 33 MHz MIN MAX 20 17 10 17 70 0 20 17 10 80 80 0 32 40 45 10 10 125 10 55 12 20 95 10 60 90 105 140 55 0 UNIT
EXTERNAL PROGRAM MEMORY TLHLL ALE PULSE DURATION TAVLL ADDRESS SET-UP TIME TO ALE TLLAX ADDRESS HOLD TIME AFTER ALE TLLIV TIME FROM ALE TO VALID INSTRUCTION INPUT TLLPL TIME FROM ALE TO CONTROL PULSE PSEN TPLPH CONTROL PULSE DURATION PSEN TPLIV TIME FROM PSEN TO VALID INSTRUCTION INPUT TPXIX INPUT INSTRUCTION HOLD TIME AFTER PSEN TPXIZ INPUT INSTRUCTION FLOAT DELAY AFTER PSEN TAVIV ADDRESS TO VALID INSTRUCTION INPUT TPLAZ TO PSEN ADDRESS FLOAT TIME EXTERNAL DATA MEMORY TLHLL ALE PULSE DURATION TAVLL ADDRESS SET-UP TIME TO ALE TLLAX ADDRESS HOLD TIME AFTER ALE TRLRH RD PULSE DURATION TWLWH WR PULSE DURATION TRLDV RD TO VALID DATA INPUT TRHDX DATA HOLD TIME AFTER RD TRHDZ DATA FLOAT DELAY AFTER RD TLLDV TIME FROM ALE TO VALID DATA INPUT TAVDV ADDRESS TO VALID INPUT TLLWL TIME FROM ALE TO RD OR WR TAVWL TIME FROM ADDRESS TO RD OR WR TWHLH TIME FROM RD OR WR HIGH TO ALE HIGH TQVWX DATA VALID TO WR TRANSITION TQVWH DATA SET-UP TIME BEFORE WR TWHQX DATA HOLD TIME AFTER WR TRLAZ ADDRESS FLOAT DELAY AFTER RD
NOTE: 1. The maximun operating frequency is limited to 40 MHz and the minimum to 3.5 MHz.
NS NS NS NS NS NS NS NS NS NS NS NS NS NS NS NS NS NS NS NS NS NS NS NS NS NS NS NS
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External clock drive XTAL SYMBOL fCLK tCLCL tCHCX tCLCX tCLCH tCHCL tCY PARAMETER clock frequency clock period HIGH time LOW time RISE time FALL time cycle time (tCY = 12 tCK) VARIABLE CLOCK MIN MAX 1.2 40 63 833 20 tCK-tCLCX 20 tCK-tCHCX 20 20 0.75 10 UNIT MHz ns ns ns ns ns ms
SERIAL PORT CHARACTERISTICS
Serial Port Timing : Shift Register Mode VDD = 5V10%; VSS = 0V; Tamb=0C; Load Capacitance = 80 pF SYMBOL tXLXL tQVXH tXHQX tXHDX tXHDV PARAMETER Serial Port clock cycle time Output data setup to clock rising edge Output data hold after clock rising edge Input data hold after clock rising edge Clock rising edge to input data valid 33 MHz OSCILLATOR MIN MAX 360 167 5 0 167 UNIT ns ns ns ns ns
EXTERNAL CLOCK DRIVE WAVEFORM
VCC-0.5 0.45V 0.7 VCC 0.2 VCC-0.1 TCLCX TCHCL TCLCL TCHCX TCLCH
AC TESTING INPUT, OUTPUT WAVEFORMS
VCC-0.5 0.45V 0.2 VCC+0.9 0.2 VCC-0.1
FLOAT WAVEFORM
VLOAD+0.1V VLOAD VLOAD-0.1V VOH-0.1V
TIMING REFERENCE POINTS
VOL+0.1V
AC Inputs during testing are driven at VCC-0.5V for a Logic "1" 0.45V for a Logic "0". Timing measurements are made at VIH min for a Logic "1" and VIL max for a Logic "0".
For timing purposes a port pin is no longer floating when a 100 mV change from load voltage occurs, and begins to float when a 100mV change form the loaded VOH/VOL level occurs. IOL/IOH = + 20 mA
P/N:PM1053 Specifications subject to change without notice, contact your sales representatives for the most update information.
REV. 1.0, DEC. 10, 2003
19
MX10FMAXDPC MX10FMAXDQC
EXTERNAL PROGRAM MEMORY READ CYCLE
TLHLL
ALE
TLLPL TAVLL TLHIV TPLIV TPLIP
PSEN
TPLAZ TLLAX TPXIX TPXIZ
PORT 0
A0 - A7
TAVIV
INSTR IN
A0 - A7
PORT 2
A8 - A15
A8 - A15
EXTERNAL DATA MEMORY READ CYCLE
ALE
TLHLL TWHLH
PSEN
TLLWL
TLLDL TRLRH
RD
TAVLL TLLAX TRLDV TRLIZ
TRHDZ TRHDX
PORT 0
A0-A7 FROM RI OR DPL
TAVWL TAVDV
DATA IN
A0-A7 FROM PCL
INSTR. IN
PORT 2
P2.0-P2.7 OR A8-A15 FROM DPH
A8-A15 FROM PCH
P/N:PM1053 Specifications subject to change without notice, contact your sales representatives for the most update information.
REV. 1.0, DEC. 10, 2003
20
MX10FMAXDPC MX10FMAXDQC
EXTERNAL DATA MEMORY WRITE CYCLE
ALE
TLHLL TWHLH
PSEN
TLLWL TWLWH
WR
TAVLL TLLAX TQVWX TQVWH TWHQX
PORT 0
A0-A7 FROM RI OR DPL
TAVWL
DATA OUT
A0-A7 FROM PCL
INSTR. IN
PORT 2
P2.0-P2.7 OR A8-A15 FROM DPH
A8-A15 FROM PCH
SHIFT REGISTER MODE TIMING WAVEFORMS
INSTRUCTION ALE
0
1
2
3
4
5
6
7
8
TXLXL
CLOCK
TXHQX TQVXH
OUTPUT DATA WRITE TO SBUF
0
TXHDV
1
2
3
4
5
6
7
TXHDX
INPUT DATA CLEAR RI
VALID
VALID
VALID
VALID
VALID
VALID
VALID
VALID
P/N:PM1053 Specifications subject to change without notice, contact your sales representatives for the most update information.
REV. 1.0, DEC. 10, 2003
21
MX10FMAXDPC MX10FMAXDQC
Package Information DIP 40
P/N:PM1053 Specifications subject to change without notice, contact your sales representatives for the most update information.
REV. 1.0, DEC. 10, 2003
22
MX10FMAXDPC MX10FMAXDQC
Package Information PLCC 44
P/N:PM1053 Specifications subject to change without notice, contact your sales representatives for the most update information.
REV. 1.0, DEC. 10, 2003
23
MX10FMAXDPC MX10FMAXDQC
MACRONIX INTERNATIONAL CO., LTD.
HEADQUARTERS:
TEL:+886-3-578-6688 FAX:+886-3-563-2888
EUROPE OFFICE:
TEL:+32-2-456-8020 FAX:+32-2-456-8021
JAPAN OFFICE:
TEL:+81-44-246-9100 FAX:+81-44-246-9105
SINGAPORE OFFICE:
TEL:+65-348-8385 FAX:+65-348-8096
TAIPEI OFFICE:
TEL:+886-2-2509-3300 FAX:+886-2-2509-2200
MACRONIX AMERICA, INC.
TEL:+1-408-453-8088 FAX:+1-408-453-8488
CHICAGO OFFICE:
TEL:+1-847-963-1900 FAX:+1-847-963-1909
http : //www.macronix.com
MACRONIX INTERNATIONAL CO., LTD. reserves the right to change product and specifications without notice.
22

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